Gentlemen,
We have a seies of chips that we have had made by MOSIS. In the past, we had them packaged in plastic packages. Some users run this chip in vacuum. We have the thermal issues well under control. We just revised the design, and MOSIS now seems unable to provide us with packaging in plastic. They are recommending a ceramic package. We are worried that with repeated cycling between air and vacuum, the lids may blow off. These systems may be cycled between air and vacuum several hundred times over their life. We are asking MOSIS about whether they have a process available to fill the package cavity. The candidate packages are 128-lead, 14x14 and 14x20 mm package outline.
Does anybody have experience with ceramic chips and cycling between air and vacuum? I'm guessing the space community has a lot of experience with this issue.
Thanks for any guidance anybody can give.
Jon