Hi
I have been looking into the GigaDevice GD32 Cortex M3 microcontroller
It has a REALLY nice price performance ratio
So I dug a little deeper, and found that they do not integrate the flash an d microcontroller on the same die as a normal microcontroller, but instead they use a single die variant of logic and core, and glues a serial flash o n top of that
Link to picture:
It's qoute ingenious, since then they can without changing the core die jus t change flash sizes by popping in a diffent flash die
But, I am questioning the reliability of such a construction
What happens at a lot of thermal cycles, does the glue give up and the bond wires likewise?
GigaDevice has a thermal shock report that shows 0 defects after 500 cycles , which is the industry norm.
I would however like to hear if any one here has experience with that kind of construction? My feeling is that it is ok because the thermal expansion coefficient of the 2 dies are the same, so the stress on the glue is low, b ut I am not an expert at all in die and glue technology
Any insights group?
Regards
Klaus