Hello All :
I recently returned a batch of thirty PCB's to a supplier for re-work - the BGA devices had some intermittent connections on a couple of boards and I wanted them all to be re-reflowed on a re-work station and re-tested.
It seems that they just put the whole board back through a reflow oven. Even those components that had been hand fitted after the initial reflow.
So now I see a slight discoloration in the cans of the through hole electrolytics.
I want them to replace all the through hole electrolytics, believing there is at least a chance that the reflow damaged them. The cap manufacturers (Panasonic and Nichicon) don't specify anything like reflow temperature withstand for through hole parts, just for SM parts.
Does anybody have any experience of what happens if through-hole can electrolytics are reflowed in this way ?
Am I unnecessarily concerned, given that leg seals etc are already rated for wave soldering, and that SM electrolytics are rated for reflow and are pretty much the same design ?
Thanks. Gary