I don't see why not. Disclaimer: offset in Vf, TJ, etc. manifests as a somewhat constant offset in current. So, if you derate the total by the worst case difference (maybe, say, 10A), you still get a beefy sum (50A) without worrying about breaking things.
Advice of this nature applies most importantly to separate diodes, BJTs or IGBTs in parallel. Probably, co-pack devices are close enough not to mind, let alone monolithic pairs (if they are such).
Here's an example from my junk bin:
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SR3540PT
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Cracked open, two dies. Placed pretty far apart, good to know for heatsink design. Possibly done to minimize lead length?
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Breaking the lead off, it's apparent the bond wire isn't so much a wire as a strip (of thin copper, apparently). This looks to be soldered, welded or brazed to the lead itself, and soldered to the die (or some other sort of die-attach). The die to base plate bond doesn't look like much, but may be solder as well. (The brittleness of the bond-to-lead joint probably suggests die-attach rather than metallurgical methods?)
Tim