Hi:
I frequently assemble PCBs by hand soldering MLCCs of the 0603, 0805,
1206, and a few larger ones (and other parts too--as those capacitor-only circuits aren't much fun!).My hand soldering technique is to use 0.015" wire solder,
- first adding a tiny bit of solder to one pad.
- Then I flux both pads, and tack the part to the pad with the added solder.
- Sometimes at this point, I put my tweezers on top of the part to create a downward force, and reflow the tacked joint to make the part seat squarely on the pads.
- Then I solder the other pad-to-part joint.
- If necessary to make it look nicer, I add flux and reflow the tacked joint.
The question is this: How much should I worry about thermal stress cracking or otherwise damaging the MLCC dielectrics?
I have heard that using a pre-heated PCB, and soldering the MLCCs both joints at once using hot air is the preferred approach, to avoid damage.
Also, that MLCCs with thinner dielectrics are more susceptible, like high values in small sizes.
Yet in practice, I've never noticed a bad part. Then again, since most of them are bypass caps, it's hard to notice a bad part.
Any experiences with soldering causing MLCC damage?
How about board flexing? What amount of flex causes trouble? Ordinary fondling? Assembling CPU coolers onto PC motherboards is always a treacherous experience! I wonder how many MLCCs survive that experience.