Well now you've got me curious. Surely this shouldn't exist, then..?
formatting link
ICS. Of course, the printing photographs terribly. It reads:
8357196
0804
9LPRS3558GLF
(Everything else on the board is early 2008, so that should be 4th week
2008.)
Size: 64 pins, looks to be 0.65mm pitch (TSSOP narrow body), unknown if there are exposed pads underneath.
I'm guessing the die is smaller than 8000 x 3000, but if they're using a standard lead frame, I can't imagine the bonding / encapsulation would be all that great?
And how do they fill any of these things in the first place? The resin must be extremely low viscosity, which makes no sense given the amount of solids in it (try burning an IC to ash some time; too hot and it sinters into a ceramic puck, with little shrinkage -- it's a dense composite to begin with). It can't be injected with too much pressure, or else the bond wires would get pushed around. And all the commercially available resins I know of, that have low viscosity, they suck!
Tim
--
Seven Transistor Labs
Electrical Engineering Consultation
Website: http://seventransistorlabs.com
"Jon Elson" wrote in message
news:t9adncQY-dwK8o7JnZ2dnUU7-SGdnZ2d@giganews.com...
> Hello, all,
>
> We have been revising an ASIC we have made several versions of, already.
> It was already pretty rectangular, the guy who designed it has now made
> it even MORE elongated, about 8 x 3 mm. We moved up to the package with
> the next larger cavity that MOSIS can supply, hoping to avoid any
> problems
> with the angles of bonding wires. Now, MOSIS tell us the wire LENGTHS
> are too long for a molded plastic package. ARRGHhhh! Can anyone
> suggest a plastic package outfit that might have a better fit package
> for a very rectangular chip? It needs at least 116 pins, we were
> looking
> at two packages that had 11 x 11 mm die attach areas, one with 120 pins,
> the other 128.
>
> We are hoping to avoid re-laying out the chip to make it more square.
>
> Jon
>
>