We're thinking about using the bga/chip-scale EPC ganfets as replacements for the now-EOL Avago phemts. EPC2007C is one interesting part. The package is tiny, with the dimensions in microns.
Is anyone using these parts?
If I want to dissipate about a watt, I don't trust that I can keep it cool using just PCB traces and vias. If we could cool it from the top, the substrate, it should be OK. There are some notes and pics online, but they are fuzzy and look awkward, and I can't find anyone who sells heat sinking stuff for these chips.
Any ideas on practical ways to heatsink these parts from above, mounted on an ordinary PC board? It needs to be reasonably easy to assemble, and to rework. Preferably minimal machining and mixing.